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CiA

canAnaliser




Wolfhard Lawrenz

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CAN System Engineering.
From Theory to Practical Applications

Изд-во Springer, дискета, 1997, 214 иллюстраций, 473 стр., анг./нем. версии

Краткое описание

В книге рассмотрены опции CAN канального уровня и физического уровня с подробными реализациями. Представлено введение в протоколы высокого уровня. Рассмотрены некоторые приложения и продукты. В последней главе изложены пояснения по выполнению разработок и тестирования.

Оглавление

       CONTENTS

1.    INTRODUCTION

2.    BASIC COMMUNICATION PROTOCOL CHARACTERISTICS
    2.1    "Traditional" Industrial Control Protocols 
        2.1.1    Characteristics and Requirements 
        2.1.2    Implementations

    2.2    CAN and other "Autobus" Protocols 
        2.2.1    Characteristics and Requirements 
        2.2.2    Implementations

    2.3    CAN Silicon Solutions 
    2.4    Protocol Comparison

3.    CAN ARCHITECTURE 
    3.1    CAN Basic Implementation Forms 
    3.2    CAN Generic Implementation Model

4.    CAN CHIP IMPLEMENTATIONS AND BASIC SOFTWARE ROUTINES 
    4.1    CAN Specifications 2.0A and 2.0б 
        4.1.1    CAN Messages 
        4.1.2    Frame Coding 
        4.1.3    Arbitration 
        4.1.4    Exception Handling 
        4.1.5    Timing Considerations 
        4.1.6    Bit Timing and Synchronization

    4.2    CAN Standalone Implementations 
        4.2.1    Basic CAN: Philips 82C200 (2.0A) 
        4.2.2    Full/Basic CAN: Intel 82527 (2.0б) 
        4.2.3    Full-/Basic CAN: Siemens 81 C90/81 C91 (2.0A, 2.0б passive) 
        4.2.4    Full/Basic CAN: Texas Instruments (2.0б)

    4.3    CAN Integrated Implementations with Microcontroller 
        4.3.1    Basic CAN (2.0A) + 8У51 Processor: Philips 8xC592/8xCE598 
        4.3.2    Basic CAN + 68HC05 Processor: Motorola MCAN Module 
        4.3.3    Basic CAN (2.0A, 2.0б passive) + COP888BC Processor: National Semiconductor COP684BC/COP884BC 
        4.3.4    Full/Basic CAN (2.0б) + 80C167 Processor: The On-Chip CAN Module on the Siemens Microcontrollers C167CR and C515C 
        4.3.5    Full/Basic CAN (2.0б) + 68xxx Processor: The Motorola TOUCAN Microcontroller Module 
        4.3.6    Full/Basic CAN (2.0б) + 8xC196 Processor: Intel 8xC196CA/8xC196CB 
        4.3.7    Full/Basic CAN (2.0б) + STIOF167 Processor: SGS STIOF167CAN 
        4.3.8    Full/Basic CAN (2.0б) + Intermetall Processor: Intermetall CEVE

    4.4    CAN Stand Alone SLIO Implementations with I/O Registers 
        4.4.1    SLIO-CAN: Philips 82C150 (2.0A, 2.0б passive) 
        4.4.2    SLIO-CAN: National Semiconductor MM57C360/MM57C362 (2.0A, 2.0б passive)

5.    THE CAN PHYSICAL LAYER 
    5.1    Overview and Implementation Aspects of the ISO 11898 CAN Physical Layer 
       
5.1.1    Overview 
        5.1.2    Structure of a High-Speed CAN Transceiver 
        5.1.3    Characteristics of Advanced Transceiver Products 
        5.1.4    EMC Aspects and Measurement Results

    5.2    Impact of Bit Timing and Signal Amplitude on the CAN Bus Length 
       
5.2.1    CAN Bit Timing 
        5.2.2    Bus Signal Amplitude 
        5.2.3    Maximum Drop Cable Length 

    5.3    Basic Signal Transmission Considerations 
    5.4    Basic Network Wiring Recommendations 
    5.5    EMC Test Procedures for CAN Transceivers 
    5.6    CAN Transceivers and Recommended Network Wiring 
       
5.6.1    Temic CAN Transceiver: б 1001 IS 
        5.6.2    Philips Semiconductors CAN Transceiver: PCA 82C250 -8V, +18Vmax, PCA 82C251 -36V, +36Vmax 
        5.6.3    Alcatel Mietec CAN Transceiver: MTC 3054 
        5.6.4    Robert Bosch CAN Transceiver: CF150B 
        5.6.5    Texas Instruments CAN Transceiver: SN75LBC032/031 
        5.6.6    A Choice of Common Mode Choke Coil Suppliers

6.    CAN "HIGHER LAYER" APPLICATION INTERFACE 
    6.1    Generic Application Interface Architecture 
        6.1.1    Overview 
        6.1.2    Virtual Leveled Systems Architecture and Tools 
        6.1.3    Shared Variables 
        6.1.4    Priority Assignment and Timing Considerations

    6.2    The CAN Application Layer (CAL) 
        6.2.1    CMS - CAN Based Message Specification 
        6.2.2    NMT - Network Management 
        6.2.3    DBT - Distributor 
        6.2.4    LMT - Layer Management 
        6.2.5    An Example Application 
        6.2.6    Experiences with CAL 

    6.3    CAN Profiles "CANopen" 
        6.3.1    Device Profiles 
        6.3.2    Communication Profile 

    6.4    The DeviceNet Communication Network 
        6.4.1    Introduction 
        6.4.2    DeviceNet Architecture 
        6.4.3    Physical Layer 
        6.4.4    Link Access 
        6.4.5    Application Layer 
        6.4.6    Predefined Master/Slave Connection Set 
        6.4.7    DeviceNet Addressing 
        6.4.8    Device Profiles 
        6.4.9    An Application Example 
        6.4.10  Key DeviceNet Differentiators 
        6.4.11  Summary 
        6.4.12  Open DeviceNet Vendor Association

    6.5    Smart Distributed System: Distributed Control for Factory Floor Automation 
        6.5.1    Introduction 
        6.5.2    Smart Distributed System in Practice 
        6.5.3    System Specifics 
        6.5.4    Physical Layer Specification 
        6.5.5    Application Layer Specifications 
        6.5.6    Party "Partners" Program and Conformance Tests 
        6.5.7    Get Information 
        6.5.8    Conclusion

7.    CAN APPLICATION EXAMPLES 
    7.1    Universal Industrial Process Control with CAN 
        7.1.1    Process Control Unit NiPC 
        7.1.2    Signal Conditioning Modules ScBB 
        7.1.3    Connection to Process (PSA) 
        7.1.4    CAN Interface 
        7.1.5    RS232C Interface 
        7.1.6    Support for Software Design

    7.2    Textile Machines with CAN 
        7.2.1    Today's ePPB Control Network 
        7.2.2    New Machine Bus Requirements 
        7.2.3    The Star Frame Card 
        7.2.4    Test Structure of a CAN Bus 
        7.2.5    Results of the Test 
        7.2.6    Implementation Suggestions 
        7.2.7    Recapitulation and Prospects

    7.3    Construction and Mining Machines with CAN 
        7.3.1    System Structures 
        7.3.2    System Concept 
        7.3.3    Hard- and Software Realization 
        7.3.4    Communication Structures 
        7.3.5    Summary and Future

    7.4    CAN in a Process Control System 
        7.4.1    Parallel or Serial System Bus? 
        7.4.2    Selection of the Bus System 
        7.4.3    System Architecture 
        7.4.4    Used Chips, Physical Structure of the Bus 
        7.4.5    Data Transfer 
        7.4.6    Encoding Messages 
        7.4.7    Time Behaviour, Data Throughput, Interrupt Load for the CPU 391 
        7.4.8    Summary

8.    CAN TESTING TECHNIQUE 
    8.1    CAN System Design and Testing 
        8.1.1    Design Object Automotive Bus 
        8.1.2    Communication Concepts for Different Requirements 
        8.1.3    Controller Link Network Capabilities 
        8.1.4    System Design Model 
        8.1.5    Design Environment

    8.2    Simulation 
        8.2.1    Simulators for CAN Networks 
        8.2.2    CAN Network Modelling Cycle 
        8.2.3    Using the CAN Network Simulator 
        8.2.4    Hints for Using the Demo Simulator

    8.3    Real-time Modelling, Testing and Interfacing 
        8.3.1    System Design Methodology 
        8.3.2    System Development and Test Tools 
        8.3.3    Evaluation 
        8.3.4    Monitor 
        8.3.5    CAN Interfaces for Development, Design, and Test Tools

9.    CAN FUTURE TRENDS

       REFERENCES

       INDEX

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